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Microelectronics Packaging and Material

BM-W630 Reflow Oven

Purpose

Semi-conductor Assembly Centre

BM-W430 reflow oven is capable of reflow soldering of surface mounted electronic components to printed circuit boards(PCB).

Reflow oven with a control panel and ventilation openings for PCB soldering

Capability

BM-W430 reflow oven is capable of reflow soldering of surface mounted electronic components to printed circuit boards(PCB)

Specifications

  • Lead-free processing capability

  • Maximum temperature: up to 350 ºC

  • Temperature uniformity: ±2 ºC

  • Maximum board width: 300 mm

  • 6 heating zones individually controlled

  • Ready nitrogen inlet

Applications

  • PCB fabrication for low to mid production requirement in the range of 300-600pcs/ 8 hours

  • Bake and cure non-PCB products such as epoxy and silver paste

  • Packaging moisture/reflow sensitivity classification for surface mounted devices

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