Skip to main content

Government officials will never ask you to transfer money or disclose bank log-in details over a phone call.

Call the 24/7 ScamShield Helpline at 1799 if you are unsure if something is a scam.

Microelectronics Packaging and Material

BM-W630 Reflow Oven

Purpose

Semi-conductor Assembly Centre

BM-W430 reflow oven is capable of reflow soldering of surface mounted electronic components to printed circuit boards(PCB).

Reflow oven with a control panel and ventilation openings for PCB soldering

Capability

BM-W430 reflow oven is capable of reflow soldering of surface mounted electronic components to printed circuit boards(PCB)

Specifications

Lead-free processing capability
Maximum temperature: up to 350 ºC
Temperature uniformity: ±2 ºC
Maximum board width: 300 mm
6 heating zones individually controlled
Ready nitrogen inlet

Applications

PCB fabrication for low to mid production requirement in the range of 300-600pcs/ 8 hours
Bake and cure non-PCB products such as epoxy and silver paste
Packaging moisture/reflow sensitivity classification for surface mounted devices