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Facilities & equipments
Explore our suite of facilities & equipments.
37 articles
3D Hand Held Scanner
Purpose
Engineering equipments
The 3D scanning hand held scanner is able to capture a product surface profiles for 3D modelling.
Advance Manufacturing Facilities & Equipments
AG-IC 100kN Universal Tester
Purpose
Material Characterization Centre
This universal tester is capable of performing tension and compression tests up to 100kN.
Microelectronics Packaging and Material
AM410 Planetary Ball Mill
Purpose
Material Characterization Centre
AM410 Planetary Ball Mill is suitable for soft, medium-hard, hard, brittle and ductile samples. The grinding can be done either dry or wet, wet is suitable for high fineness, even meets the requirements of preparing alloy by mechanical method.
Microelectronics Packaging and Material
Benchtop pH/ISE/EC Dual Channel Meter (HI5522)
Purpose
Material Characterization Centre
HI5522 is a benchtop pH/ORP/ISE and EC/TDS/Salinity/Resistivity meter with a two-channel meter that allows for simultaneous measure of pH, ORP, or ISE on one channel and EC, TDS, Salinity, or Resistivity on the other.
Microelectronics Packaging and Material
BINDER HTS Chamber
Purpose
Reliability Testing
BINDER FD53 forced air convection oven is a high temperature storage test chamber with controlled temperature for environmental testing of specimens.
Microelectronics Packaging and Material
BM-W630 Reflow Oven
Purpose
Semi-conductor Assembly Centre
BM-W430 reflow oven is capable of reflow soldering of surface mounted electronic components to printed circuit boards(PCB).
Microelectronics Packaging and Material
Dage 5000 Bond Tester
Purpose
Material Characterization Centre
This bond tester is capable of performing pull and shear applications up to specific threshold loads.
Microelectronics Packaging and Material
Dispermill Discovery 100 High Speed Disperser
Purpose
Material Characterization Centre
Dispersing process is crucial for fine mixing of solids into liquids. Dispermill Discovery 100 is a high speed disperser which offers a wide range of fine mixing applications that can be used for different industries.
Microelectronics Packaging and Material
Dynamic Mechanical Analysis
Purpose
Material Characterization Centre
Dynamic Mechanical Analysis (DMA) is an important technique used to measure the mechanical and viscoelastic properties of materials such as thermoplastics, thermosets, elastomers, ceramics and metals.
Microelectronics Packaging and Material
Eddy Current Electrical Conductivity Meter
Purpose
Material Characterization Centre
Portable eddy current instrument which measures the electrical conductivity of non-ferromagnetic metals based on the complex impedance of the measuring probe.
Microelectronics Packaging and Material