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Institute of Technical Education
Microelectronics Packaging and Material

K&S 4523 Wire Bonder

Purpose

Semi-conductor Assembly Centre

The K&S 4523 wire bonder is capable of performing thermo-sonic wire bonding with high resolution in Y motion.

Wire bonder machine with an electronic component being mounted
Close-up of a microchip with several wire connections.

Capability

The K&S 4523 wire bonder is capable of performing thermo-sonic wire bonding with high resolution in Y motion.

Specifications

  • Gold and aluminum wire bonding (0.5 to 3 mil wire diameter)

  • Bonding Area: 134 mm x 134 mm

  • Throat Depth: 143mm

  • 0.63 -4.0 Magnification

  • Z Travel: 6.6 / 12.7mm (Low Reset / High Reset)

  • Temperature Controller: up to 250 degC

  • Offers Control of Individual Bond Parameters, Loop Height and Force

Applications

  • Hybrid/MCMs

  • Chip on board

  • Microwave, laser, opto-type products