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Microelectronics Packaging and Material

MAT6400 Flip Chip Bonder

Purpose

Semi-conductor Assembly Centre

This bonder performs die attach and interconnect processes for MCM, flip chip, eutectic, and ultrasonic assemblies.

Automated flip chip bonder machine with attached monitor and signal light on top

Dispensing nozzle applying adhesive onto a green PCB on a flip chip bonder fixture

Capability

This bonder performs die attach and interconnect processes for MCM, flip chip, eutectic, and ultrasonic assemblies.

Specifications

Work Area: Up to 10” x 12”
Die size range: 0.2 mm to 25 mm
Die presentation: 2”/4” waffle/gel packs
Accuracy: ±3um
Volumetric dispenser with programmable dispense time, dwell time, reverse time, dispense height and shape parameters

Applications

Multi chip modules, imaging devices, sensors and MEMS devices
Full flip chip process including chip flipping, bump fluxing and chip final alignment over up looking camera
Capillary underfillprocess to enhance solder joint reliability