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Institute of Technical Education
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Microelectronics Packaging and Material

Sample Preparation

Purpose

Material Characterization Centre

Sample preparation for metallographic analysis, crossing sectioning of microelectronics or PCB samples for structural and failure analysis.
Equipment for sample preparation including cutter, polisher, molds, and polishing discs

Capability

Sample mounting 

  • Epoxy resin and mounting molds of different sizes

Cutting

  • DTQ-5 Low speed saw

  • Diamond saw blade

Grinding and Polishing

  • Mecatech 264 Polisher with variable speed control

  • 250 mm polishing plates

  • Grinding and Polishing paper of different grades 

  • Polishing suspensions (Diamond and Alumina)

Applications

  • Sample preparation for metallographic analysis

  • Crossing sectioning of microelectronics or PCB samples for structural and failure analysis

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