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Microelectronics Packaging and Material

SMT Stencil Printer SP600L

Purpose

Semi-conductor Assembly Centre

The printer is a high precision semi automatic SMT stencil printer with very large pressure fields. It is equipped with dual camera system for fast printed circuit board orientation coupled with programmable speed control for both blade and separation of stencil.

SMT stencil printer with a control panel and display monitor for electronics manufacturing

Capability

The printer is a high precision semi automatic SMT stencil printer with very large pressure fields. It is equipped with dual camera system for fast printed circuit board orientation coupled with programmable speed control for both blade and separation of stencil.

Specifications

Stencil frame size: 350 x 350mm to 838 x 736mm
Printing Area: Max. 600 x 600mm
Board Size: 650 x 650mm
X and Y axis range: +/-13mm
Theta rotation: +/-3.5⁰
Underside clearance: 25mm
Z axis range: 0 -35mm
Repeatability: +/-0.01mm

Applications

Deposition of solder paste on printed circuit board, flexible circuit and substrate

Detailed view of a circuit board with several small surface-mount components

Close-up of a circuit board showing multiple solder pads in a grid pattern