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Microelectronics Packaging and Material

X-ray Inspection System

Purpose

Material Characterization Centre

Dage XD 6600 X X-ray system is capable of performing high resolution X-ray inspection on electronic components.

Dage XD6600 X-ray inspection system used for non-destructive testing of electronic components
Close-up of an electronic circuit board with mounted integrated chips and components
Underside view of a Ball Grid Array (BGA) chip with solder balls on a circuit substrate

Capability

Dage XD 6600 X X-ray system is capable of performing high resolution X-ray inspection on electronic components.

Specifications

  • X-ray tube type: Open (demountable)
    with tungsten transmission target

  • Maximum inspection area: 18” x 16”
    (458 x 407mm)

  • Maximum sample weight: 5 kg

  • System magnification: Up to 5450x

  • Oblique angle view: 0 – 45 ⁰

Applications

  • Failure analysis on circuit board
    (PCB), inspection of semiconductors
    and solder joints.

  • Inspection of defects or voids at
    interfaces for solar panels.

  • Useful for research and development
    as well as production environment.

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