BM-W630 Reflow Oven

Capability

BM-W430 reflow oven is capable of reflow soldering of surface mounted electronic components to printed circuit boards(PCB)

Specifications

• Lead-free processing capability
• Maximum temperature: up to 350 ºC
• Temperature uniformity: ±2 ºC
• Maximum board width: 300 mm
• 6 heating zones individually controlled
• Ready nitrogen inlet

Applications

• PCB fabrication for low to mid production requirement in the range of 300-600pcs/ 8 hours
• Bake and cure non-PCB products such as epoxy and silver paste
• Packaging moisture/reflow sensitivity classification for surface mounted devices