BM-W630 Reflow Oven
BM-W6830 Reflow Oven


BM-W430 reflow oven is capable of reflow soldering of surface mounted electronic components to printed circuit boards(PCB)


  • Lead-free processing capability
  • Maximum temperature: up to 350 ºC
  • Temperature uniformity: ±2 ºC
  • Maximum board width: 300 mm
  • 6 heating zones individually controlled
  • Ready nitrogen inlet


    • PCB fabrication for low to mid production requirement in the range of 300-600pcs/ 8 hours
    • Bake and cure non-PCB products such as epoxy and silver paste
    • Packaging moisture/reflow sensitivity classification for surface mounted devices