Capability
The K&S 4523 wire bonder is capable of performing thermo-sonic wire bonding with high resolution in Y motion.
Specifications
- Gold and aluminum wire bonding (0.5 to 3 mil wire diameter)
- Bonding Area: 134 mm x 134 mm
- Throat Depth: 143mm
- 0.63 -4.0 Magnification
- Z Travel: 6.6 / 12.7mm (Low Reset / High Reset)
- Temperature Controller: up to 250 degC
- Offers Control of Individual Bond Parameters, Loop Height and Force
Applications
- Hybrid/MCMs
- Chip on board
- Microwave, laser, opto-type products