This bond tester is capable of performing pull and shear applications
up to specific threshold loads.
- Wire bond ball, solder bump and die shear testing up to 100kg
- Wire pull testing up to 100g.
- Performed in accordance with:
• Solder bump shear - JEDEC JESD22 JESD22-B117A
• Wire bond ball shear - JEDEC JESD22 JESD22-B116
• Wire pull - MIL -STDSTD-883 .
- Semiconductor wire bond and die attach bond strength testing.
- Wafer level and PCB solder joint strength measurement.