Dage 5000 Bond Tester  
Dage 5000 Bond Tester


This bond tester is capable of performing pull and shear applications
up to specific threshold loads.


  • Wire bond ball, solder bump and die shear testing up to 100kg
  • Wire pull testing up to 100g.
  • Performed in accordance with:
    • Solder bump shear - JEDEC JESD22 JESD22-B117A
    • Wire bond ball shear - JEDEC JESD22 JESD22-B116
    • Wire pull - MIL -STDSTD-883 .


  • Semiconductor wire bond and die attach bond strength testing.
  • Wafer level and PCB solder joint strength measurement.