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Microelectronics Packaging and Material

Dage 5000 Bond Tester

Purpose

Material Characterization Centre

This bond tester is capable of performing pull and shear applications up to specific threshold loads.

Dage Series 5000 bond tester with microscope and stage for precision wire and die bond testing

Illustration of wire bond pull testing showing deformation and detachment of gold wires from pads

Illustration of ball shear testing on solder balls of a BGA package showing failure progression

Capability

This bond tester is capable of performing pull and shear applications up to specific threshold loads.

Specifications

Wire bond ball, solder bump and die shear testing up to 100kg
Wire pull testing up to 100g.
Performed in accordance with:
• Solder bump shear - JEDEC JESD22 JESD22-B117A
• Wire bond ball shear - JEDEC JESD22 JESD22-B116
• Wire pull - MIL -STDSTD-883 .

Applications

Semiconductor wire bond and die attach bond strength testing.
Wafer level and PCB solder joint strength measurement.