MAT6400 Flip Chip Bonder 


This bonder performs die attach and interconnect processes for MCM, flip chip, eutectic, and ultrasonic assemblies.


  • Work Area: Up to 10” x 12”
  • Die size range: 0.2 mm to 25 mm
  • Die presentation: 2”/4” waffle/gel packs
  • Accuracy: ±3um
  • Volumetric dispenser with programmable dispense time, dwell time, reverse time, dispense height and shape parameters


    • Multi chip modules, imaging devices, sensors and MEMS devices
    • Full flip chip process including chip flipping, bump fluxing and chip final alignment over up looking camera
    • Capillary underfillprocess to enhance solder joint reliability